Printed Circuit Board Assembly
Our factory in Mexico has two fully automated assembly lines. To ensure a zero-defect output, we have installed an SPI and AOI on each of them. This gives us the ability to assemble simple to complex products.
With our flexible lines and processes, we can adapt immediately to the inevitable changes that you might encounter. Our high-speed Pick and Place machines and 10 zones reflow oven can support projects in the prototype phase as well as mass production.
Technical Capabilities
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Assembly type |
• SMT • THT • Single and Double Sided |
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Component type |
• up to 0201 / up to 0.3mm Pitch • QFP, QFN, BGA, CSP, etc. |
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Component packaging |
• Full Reel • Cut Tape • Tube • Tray |
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Soldering |
• Reflow Oven • Wave Soldering • Manual Soldering |
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Other |
• IC Programming • Function Test • Conformal Coating • Potting |
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Production grade |
IPC Class 2 and 3 |
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Lead time |
2-3 Weeks |
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Equipment
• PCB Feeder
• Automatic Stencil Printer
• SPI (Solder Paste Inspection)
• PnP (Pick and Place)
• Reflow Oven
• AOI (Automated Optical Inspection)
• Offline X-Ray
SPI - Solder Paste Inspection
Solder Paste Inspection, is a specialized process that inspects the solder paste deposit quality on the PCB. In most of the cases, the reason behind the improper functioning of the PCB is due to improper solder paste printing. Solder paste inspection is therefore an essential technique that ensures costs are kept as low as possible by detecting faults in the solder printing stage of the production line.
AOI - Automatic Optical Inspection
The AOI is one of the best inspection tools in the SMT environment. It helps identify issues and defects in the early stages of the manufacturing process.
Any small defect in terms of component placement, lead solder bond, and component functionality can lead to drastic repair cost and field failures
The High Resolution camera on the AOI will identify soldering short circuits, Tombstone, missing solder, misplaced and missing components, etc.
X-Ray
On BGA and leadless components the pads are not visible to the naked eye.
X-Ray inspection is needed in such case to find hidden assembly defects. X-Rays can penetrate the IC package, and will reflect on Higher Density features such as the metal connections. The image of the board can be analyzed to detect assembly problems.